Acid anhydride compound, polyamideimide resin and film

ChangeBridge: Patent Grants - Organic Chemistry (C07D)

Published April 7th, 2026

Detected April 7th, 2026

Summary

USPTO granted Patent US12595268B2 to Korea Advanced Institute of Science and Technology (KAIST) for a novel acid anhydride compound and polyamideimide resin and film utilizing the same. The invention provides high thermal resistance, low coefficient of thermal expansion, and colorless transparency properties. The patent contains 11 claims and was filed under Application No. 18517326.

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What changed

USPTO issued Patent US12595268B2 granting exclusive intellectual property rights to KAIST for an acid anhydride compound with a novel chemical structure, and polyamideimide resin and film produced therefrom. The patent claims cover the compound's use in films exhibiting high thermal resistance, low thermal expansion, and optical transparency.

For manufacturers and researchers in polymer chemistry and advanced materials, this patent establishes enforceable IP rights that may restrict competitive development of similar acid anhydride compounds for polyamideimide film applications. Parties engaged in related chemical manufacturing or film production should assess potential licensing needs or design-around considerations.

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Source document (simplified)

← USPTO Patent Grants

Acid anhydride compound, and polyamideimide resin and film using the same

Grant US12595268B2 Kind: B2 Apr 07, 2026

Assignee

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventors

Sang Youl Kim, Seong Jong Kim

Abstract

Provided are an acid anhydride compound having a novel structure, and a polyamideimide resin and a polyamideimide film produced therefrom. Specifically, since the polyamideimide film according to the present invention includes a structural unit derived from the acid anhydride compound, it may have high thermal resistance and a low coefficient of thermal expansion while being colorless and transparent.