Acid anhydride compound, and polyamideimide resin and film using the same
Grant
US12595268B2
Kind: B2
Apr 07, 2026
Assignee
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors
Sang Youl Kim, Seong Jong Kim
Abstract
Provided are an acid anhydride compound having a novel structure, and a polyamideimide resin and a polyamideimide film produced therefrom. Specifically, since the polyamideimide film according to the present invention includes a structural unit derived from the acid anhydride compound, it may have high thermal resistance and a low coefficient of thermal expansion while being colorless and transparent.
CPC Classifications
C07D 493/04
C08G 73/14
Filing Date
2023-11-22
Application No.
18517326
Claims
11