Changeflow GovPing Consumer Protection Materials Science Trademark Application Filed
Routine Notice Added Final

Materials Science Trademark Application Filed

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Published September 30th, 2025
Detected March 26th, 2026
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Summary

The USPTO has received an intent-to-use trademark application (TM99420761) for goods and services related to materials science, including educational services and various metallic and chemical products. The application was filed on September 30, 2025.

What changed

The United States Patent and Trademark Office (USPTO) has recorded an intent-to-use trademark application, identified as TM99420761, filed on September 30, 2025. The application covers a broad range of goods and services, including educational seminars and webinars in material science and engineering, automotive and PCB electronics assembly, semiconductor and power electronics packaging, and thermal evaporation/PVD coating. It also includes various metallic goods such as nano-materials, specialty alloys, solder pastes, and conductive adhesives, as well as inorganic chemicals for industrial use and soldering flux.

This filing represents a new trademark application and does not impose any immediate compliance obligations on regulated entities. However, businesses operating in the materials science, electronics manufacturing, and related sectors should be aware of this application as it pertains to the branding and commercialization of specific products and services. Further actions by the USPTO, such as examination and potential opposition periods, will follow.

Source document (simplified)

← USPTO Trademark Applications

WE BELIEVE MATERIALS SCIENCE CHANGES THE WORLD

Intent to Use TM99420761 Kind: intenttouse Mar 25, 2026

Abstract

Educational services, namely, providing seminars, non-downloadable webinars, blogs, on-line journals, and lectures in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, inorganic industrial compounds, fusible alloys, indium-containing fabrications, and metallic indium, gallium, germanium and tin.; Metallic goods namely, metallic nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, thermal interface metallic materials, indium-containing fabrications, and metallic indium, gallium, germanium and tin all in Class 06; Providing consumer information via a website in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, thermal interface materials, inorganic industrial compounds, indium-containing fabrications, and metallic indium, gallium, germanium and tin; Indium and gallium inorganic chemicals for industrial use; soldering flux

Filing Date

2025-09-30

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Classification

Agency
USPTO
Published
September 30th, 2025
Instrument
Notice
Legal weight
Non-binding
Stage
Final
Change scope
Minor
Document ID
TM99420761

Who this affects

Applies to
Manufacturers
Industry sector
3254 Pharmaceutical Manufacturing 3345 Medical Device Manufacturing 4231 Wholesale Trade
Activity scope
Trademark Registration
Geographic scope
United States US

Taxonomy

Primary area
Intellectual Property
Operational domain
Legal
Topics
Materials Science Manufacturing

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