← USPTO Trademark Applications

WE BELIEVE MATERIALS SCIENCE CHANGES THE WORLD

Intent to Use TM99420761 Kind: intent_to_use Mar 25, 2026

Abstract

Educational services, namely, providing seminars, non-downloadable webinars, blogs, on-line journals, and lectures in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, inorganic industrial compounds, fusible alloys, indium-containing fabrications, and metallic indium, gallium, germanium and tin.; Metallic goods namely, metallic nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, thermal interface metallic materials, indium-containing fabrications, and metallic indium, gallium, germanium and tin all in Class 06; Providing consumer information via a website in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, thermal interface materials, inorganic industrial compounds, indium-containing fabrications, and metallic indium, gallium, germanium and tin; Indium and gallium inorganic chemicals for industrial use; soldering flux

Filing Date

2025-09-30