Patent Grant: Image Pickup Module, Endoscope, and Manufacturing Method

ChangeBridge: Patent Grants - Diagnosis & Surgery (A61B)

Published March 24th, 2026

Detected March 26th, 2026

Summary

The USPTO has granted a patent (US12585104B2) to OLYMPUS MEDICAL SYSTEMS CORP. for an image pickup module, endoscope, and manufacturing method. The patent details specific technical configurations for an image pickup module designed for use in endoscopes, focusing on resin application within its components.

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What changed

The United States Patent and Trademark Office (USPTO) has issued a patent grant, US12585104B2, to OLYMPUS MEDICAL SYSTEMS CORP. The patent covers an image pickup module, an endoscope, and a method for manufacturing the image pickup module. The abstract describes a specific technical configuration involving an imager, wiring board with electronic components, and a resin application method to ensure continuity within various spaces of the module.

This patent grant represents a new intellectual property right for OLYMPUS MEDICAL SYSTEMS CORP. regarding their medical imaging technology. While not a regulatory rule imposing obligations on other entities, it signifies innovation in the field of endoscopes and diagnostic imaging. Compliance officers in the medical device sector should note this development as it pertains to patentable technologies within their industry, particularly concerning manufacturing processes and component design for diagnostic and surgical equipment.

Source document (simplified)

← USPTO Patent Grants

Image pickup module, endoscope, and method for manufacturing image pickup module

Grant US12585104B2 Kind: B2 Mar 24, 2026

Assignee

OLYMPUS MEDICAL SYSTEMS CORP.

Inventors

Nau Satake

Abstract

An image pickup module includes: an imager including a light receiving surface; and a back surface opposite to the light receiving surface; a wiring board including a first surface, a bottom surface disposed in a recess surrounded by a plurality of walls, a plurality of electronic components configured to mount on the bottom surface; and a cutout communicating a first space between the back surface and the first surface with a second space inside the recess, the cutout being on a first wall of the plurality of walls; and a resin disposed in the first space, the second space and a third space inside of the cutout, in which the resin is continuous without an interface between the first space, the second space, and the third space.