Image pickup module, endoscope, and method for manufacturing image pickup module

Abstract

An image pickup module includes: an imager including a light receiving surface; and a back surface opposite to the light receiving surface; a wiring board including a first surface, a bottom surface disposed in a recess surrounded by a plurality of walls, a plurality of electronic components configured to mount on the bottom surface; and a cutout communicating a first space between the back surface and the first surface with a second space inside the recess, the cutout being on a first wall of the plurality of walls; and a resin disposed in the first space, the second space and a third space inside of the cutout, in which the resin is continuous without an interface between the first space, the second space, and the third space.

CPC Classifications