Patent Application for Signal Transmission Circuit

ChangeBridge: Patent Apps - Power Supply (H02J)

Detected March 26th, 2026

Summary

The USPTO has published a new patent application, US20260088217A1, detailing a signal transmission circuit between substrates. The application, filed on November 14, 2024, describes a method for wirelessly transmitting signals via electromagnetic coupling between two substrates.

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What changed

This document is a publication of a new patent application (US20260088217A1) filed with the USPTO. It describes a signal transmission circuit between substrates, involving conductors and connection holes on each substrate, enabling wireless signal transmission through electromagnetic coupling. The application was filed on November 14, 2024, and is scheduled for publication on March 26, 2026.

As this is a patent application, it does not impose immediate regulatory obligations or compliance deadlines on entities. However, companies involved in the design or manufacturing of electronic components, particularly those related to signal transmission or wireless power transfer, should be aware of this potential intellectual property. Reviewing the full patent application may be necessary for companies seeking to avoid infringement or to understand the scope of the claimed technology.

Source document (simplified)

← USPTO Patent Applications

SIGNAL TRANSMISSION CIRCUIT BETWEEN SUBSTRATES

Application US20260088217A1 Kind: A1 Mar 26, 2026

Inventors

TZONG-LIN WU, KE-HAN LIN, CHENG-WU TING

Abstract

The disclosure provides a signal transmission circuit between substrates, which includes a first substrate and a second substrate. The first substrate comprises a first conductor, a first reference metal surface and a plurality of first connection holes. The first reference metal surface surrounds the periphery of the first conductor. The first connection holes are provided in the body of the first substrate and connected to the first reference metal surface. The second substrate comprises a second conductor, a second reference metal surface, and a plurality of second connection holes. The second reference metal surface surrounds the periphery of the second conductor. The second connection holes are provided in the body of the second substrate and connected to the second reference metal surface. Signals are wirelessly transmitted between the first substrate and the second substrate through an electromagnetic coupling between the first conductor and the second conductor.