SIGNAL TRANSMISSION CIRCUIT BETWEEN SUBSTRATES

Abstract

The disclosure provides a signal transmission circuit between substrates, which includes a first substrate and a second substrate. The first substrate comprises a first conductor, a first reference metal surface and a plurality of first connection holes. The first reference metal surface surrounds the periphery of the first conductor. The first connection holes are provided in the body of the first substrate and connected to the first reference metal surface. The second substrate comprises a second conductor, a second reference metal surface, and a plurality of second connection holes. The second reference metal surface surrounds the periphery of the second conductor. The second connection holes are provided in the body of the second substrate and connected to the second reference metal surface. Signals are wirelessly transmitted between the first substrate and the second substrate through an electromagnetic coupling between the first conductor and the second conductor.

CPC Classifications