Patent Granted for Data Transmission/Receiving Circuit
Summary
The United States Patent and Trademark Office has granted patent US12586614B2 to SK hynix Inc. for a data transmission/receiving circuit. The patent, effective March 24, 2026, details a circuit designed to improve data transmission efficiency.
What changed
The USPTO has issued a new patent, US12586614B2, to SK hynix Inc. for a data transmission/receiving circuit. The patent describes a circuit that includes specific inductor and T-coil equalization components designed to adjust inductive peaking in response to control signals, aiming to enhance data transmission and reception capabilities.
This patent grant signifies a new intellectual property right for SK hynix Inc. in the area of semiconductor technology for data transmission. While not a regulatory rule imposing obligations on other entities, it represents a novel invention that could influence future product development and competition within the semiconductor industry. Companies operating in this space should be aware of this granted patent as it may impact their own intellectual property strategies and product designs.
Source document (simplified)
Data transmission/receiving circuit, data training circuit and semiconductor apparatus including the same
Grant US12586614B2 Kind: B2 Mar 24, 2026
Assignee
SK hynix Inc.
Inventors
Ji Hyo Kang
Abstract
A data receiving circuit includes a first inductor, a second inductor, and a T-coil equalization circuit. The first inductor is coupled between a first node coupled with a data input/output pad and a second node. The second inductor is coupled between the second node and an internal circuit. The T-coil equalization circuit includes a T-coil with at least one capacitor coupled with the second node. The T-coil equalization circuit is configured to adjust inductive peaking of the T-coil in response to a control signal.
CPC Classifications
G11C 7/1048 G11C 2207/12 G11C 7/1084 G11C 7/1078 G11C 7/1051 G06F 13/385 G06F 13/4072 G06F 2213/0002 G06F 2213/0004 G06F 2213/3852 H04L 25/0292 H03M 9/00
Filing Date
2023-12-19
Application No.
18545860
Claims
20
Named provisions
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