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USPTO Trademark Application for IoT Hardware - Tachyon

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Published March 24th, 2026
Detected March 26th, 2026
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Summary

The USPTO has received an intent-to-use trademark application for the mark 'TACHYON' by an applicant seeking to protect computer hardware modules for IoT devices. The application covers a range of components including data processing units, circuit boards, microprocessors, and integrated circuits.

What changed

This document details an "intent to use" trademark application filed with the USPTO for the mark 'TACHYON'. The application specifically covers a broad range of computer hardware modules intended for use as embedded components in Internet of Things (IoT) electronic devices. This includes items such as data processing units for edge computing, circuit boards, microprocessors, integrated circuits, and semiconductors, all designed for IoT applications and explicitly excluding use with fibre channel data communication networks or as finished wireless communication devices.

For compliance officers, this filing signifies a new potential market entrant or product line in the IoT hardware space. While this is a trademark application and not a regulatory rule, it indicates a business's intent to commercialize specific hardware. Companies operating in the IoT ecosystem, particularly those manufacturing or integrating similar components, should be aware of this filing as it may relate to future product development, market positioning, and potential intellectual property considerations. No immediate compliance actions are required based on this trademark filing.

Source document (simplified)

← USPTO Trademark Applications

TACHYON

Intent to Use TM98571311 Kind: intenttouse Mar 24, 2026

Abstract

computer hardware modules for use as embedded components in Internet of Things (IoT) electronic devices and not as finished wireless communication devices for voice, data or image transmission; data processing units specifically designed for edge computing in IoT networks; circuit boards for use in wireless Internet of Things (IoT) devices and not for use with fibre channel data communication networks; microprocessors for use in Internet of Things (IoT) devices; integrated circuit modules for use in wireless Internet of Things (IoT) devices and not for use with fibre channel data communication networks or as fibre channel interface chips; semiconductors for use in wireless Internet of Things (IoT) devices and not for use with fibre channel data communication networks or as fibre channel interface chips; semiconductors with embedded recorded software for use in internet connected embedded devices and embedded devices with radios, none of the foregoing for use with fibre channel data communication networks; integrated circuits for use in wireless Internet of Things (IoT) devices and not for use with fibre channel data communication networks or as fibre channel interface chips; integrated circuit components being electric data relays for sensors and electric actuators for network connected products, none of the foregoing for use with fibre channel data communication networks; IoT communication hardware designed exclusively for sensor-based data transmission in smart home and industrial applications, namely, embedded communication modules and development boards for engineers and original equipment manufacturers (OEMs); communication hardware in the nature of computer hardware, integrated circuit chips and computer chips providing cellular and wireless connectivity for IoT devices that collect sensor data relating to light, weather, ambient atmosphere, sound, temperature, motion and movement, magnetic fields, location, photo, video, biometrics, pressure, radioactivity, color, liquid flow, orientation, touch, and wind speed for use in Internet of Things (IoT) devices, and not as finished wireless communication devices for voice, data or image transmission; hardware development kits for designing and prototyping Internet of Things (IoT) devices, excluding downloadable software, comprised primarily of integrated circuit modules, microprocessors, cellular modem modules, power supplies, power adapters, user interface components being input controls, navigational components in the nature of sensors for directional input, informational components in the nature of display interfaces, containers, circuit boards, computer chips, and microcontrollers designed for use in IoT devices; hardware development kits comprised primarily of circuit boards, microcontrollers, and power supplies for use in non-cellular devices, all sold as part of hardware development kits for use in prototyping Internet of Things (IoT) devices; firmware for enhancing hardware connectivity in Internet of Things (IoT) devices; integrated circuits, downloadable computer software, and firmware for facilitating wireless radio frequency communications between Internet of Things (IoT) electronic devices, none of the foregoing for use with fibre channel data communication networks or as finished wireless communication devices for voice, data or image transmission; GNSS and GPS navigation modules for integration into Internet of Things (IoT) electronic devices; GNSS and GPS telematics modules, namely, satellite receiver and antenna modules for use in designing and prototyping Internet of Things (IoT) electronic devices; non-terrestrial network modem modules for use in designing and prototyping Internet of Things (IoT) electronic devices

Filing Date

2024-05-28

View original document →

Classification

Agency
USPTO
Published
March 24th, 2026
Instrument
Notice
Legal weight
Non-binding
Stage
Final
Change scope
Minor
Document ID
TM98571311

Who this affects

Applies to
Manufacturers Technology companies
Industry sector
3341 Computer & Electronics Manufacturing 5112 Software & Technology
Activity scope
Intellectual Property Protection
Geographic scope
United States US

Taxonomy

Primary area
Intellectual Property
Operational domain
Legal
Topics
Internet of Things Semiconductors

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