Sony Olympus Patent for Photoelectric Module and Camera Head

ChangeBridge: Patent Grants - Diagnosis & Surgery (A61B)

Published March 24th, 2026

Detected March 26th, 2026

Summary

The USPTO has granted a new patent (US12587727B2) to Sony Olympus Medical Solutions Inc. for a photoelectric composite module, camera head, and endoscopic device. The patent details specific technical components and their arrangement for use in medical imaging.

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What changed

The United States Patent and Trademark Office (USPTO) has issued patent US12587727B2 to Sony Olympus Medical Solutions Inc. This patent covers a photoelectric composite module, camera head, and endoscopic device, detailing the arrangement of printed boards, contacts, and a photoelectric conversion element. The patent was filed on January 30, 2024, and granted on March 24, 2026, with 20 claims.

This patent grant represents a new intellectual property asset for Sony Olympus Medical Solutions Inc. While not imposing direct regulatory obligations on other entities, it establishes exclusive rights related to the patented technology. Companies operating in the medical device manufacturing or endoscopic imaging sectors should be aware of this patent to avoid potential infringement issues and to understand the competitive landscape.

Source document (simplified)

← USPTO Patent Grants

Photoelectric composite module, camera head, and endoscopic device

Grant US12587727B2 Kind: B2 Mar 24, 2026

Assignee

Sony Olympus Medical Solutions Inc.

Inventors

Kei Tomatsu

Abstract

There is provided a photoelectric composite module according to the present disclosure including: a first connecting member having an outer frame having a tubular shape, and a plurality of contacts provided in an interior of the outer frame; a first printed board on which a photoelectric conversion element configured to convert an electrical signal into an optical signal is mounted, and which is configured to act as a relay between the contacts and the photoelectric conversion element; and a second printed board configured to act as a relay between the contacts and an electrical signal cable. The first printed board and the second printed board are three-dimensionally arranged.