Prosthetic Socket Cooling System and Method Patented
Summary
The USPTO has published a patent application for a prosthetic socket cooling system and method assigned to Liberating Technologies, Inc. The patent, filed on May 2, 2025, describes a system designed to maintain a desired temperature within a prosthetic socket.
What changed
The United States Patent and Trademark Office (USPTO) has published patent application US20260083586A1 for a "Cooling System and Method for a Prosthetic Socket." The application, filed by Liberating Technologies, Inc. on May 2, 2025, details a method involving a heat spreader and a heat extraction subsystem to regulate the temperature inside a prosthetic socket.
This publication represents a new patent filing and does not impose immediate compliance obligations on regulated entities. However, it signifies potential innovation in the prosthetics field, which medical device manufacturers and related companies may wish to monitor for competitive or technological insights. No specific compliance actions or deadlines are associated with this patent publication.
Source document (simplified)
COOLING SYSTEM AND METHOD FOR A PROSTHETIC SOCKET
Application US20260083586A1 Kind: A1 Mar 26, 2026
Assignee
Liberating Technologies, Inc.
Inventors
Ryan Myers, Kristen LeRoy, Ian Cohen, Gordon B. Hirschman, Thane R. Hunt, Kevin E. Keough, Carlos Martinez Luna, Todd R. Farrell, Jennifer L. Johansson, Brendan LaBrecque
Abstract
A method of cooling a prosthetic socket includes placing a thermally conductive heat spreader including a curved shape portion in contact with a residual limb of a user, placing a heat extraction subsystem through a wall of the prosthetic socket and coupling the heat extraction subsystem to the thermally conductive heat spreader, and operating the heat extraction subsystem to drive heat from inside the prosthetic socket to an external environment using the thermally conductive heat spreader and the heat extraction subsystem such that a desired temperature is maintained in the prosthetic socket.
CPC Classifications
A61F 7/00 A61F 2/60 A61F 2/7812 A61F 2/80 H10N 10/13 A61F 5/01 A61F 2007/0051 A61F 2007/0067 A61F 2007/0075 A61F 2007/0078 A61F 2007/0093 A61F 2007/0095 A61F 2007/0096 A61F 2007/0228 A61F 2007/0246 A61F 2007/0247 F28F 2230/00 F28F 2255/00
Filing Date
2025-05-02
Application No.
19196887
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