USPTO Patent Application: Monitoring Structure Without Chip

ChangeBridge: Patent Apps - Prosthetics (A61F)

Published June 16th, 2025

Detected March 23rd, 2026

Summary

The USPTO has published a patent application (US20260079119A1) for a "Monitoring structure without chip." The application, filed by Inventec (Pudong) Technology Corporation, describes a structure with monitoring components designed for sensing signals without relying on a traditional chip.

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What changed

This document is a USPTO patent application (US20260079119A1) for a novel "Monitoring structure without chip." The application details a structure comprising at least one first monitoring component, which includes a substrate and a signal sensing portion with multiple sensing sections arranged around the substrate's periphery. The filing date was June 16, 2025, and the publication date is March 19, 2026.

As this is a patent application, it does not impose immediate compliance obligations on regulated entities. However, it signifies potential future technological developments in medical monitoring devices. Companies in the medical device sector should be aware of this patent filing as it may relate to their product development and intellectual property strategies.

Source document (simplified)

← USPTO Patent Applications

MONITORING STRUCTURE WITHOUT CHIP

Application US20260079119A1 Kind: A1 Mar 19, 2026

Assignee

INVENTEC (PUDONG) TECHNOLOGY CORPORATION

Inventors

Wei-Chen CHENG, Yi-Cheng SHIH, Yu WU, Hsin-Hung LIN, Yu Shu TAI

Abstract

A monitoring structure without chip including at least one first monitoring component. The at least one first monitoring component includes a first substrate and a first signal sensing portion. The first signal sensing portion includes a first signal sensing section, a second signal sensing section, a third signal sensing section and a fourth signal sensing section. The first signal sensing section, the second signal sensing section, the third signal sensing section and the fourth signal sensing section are disposed along a periphery of the substrate. The first signal sensing section and the third signal sensing section are connected to two opposite ends of the second signal sensing section, respectively. The fourth signal sensing section is connected to the third signal sensing section, and is spaced apart from the first signal sensing section via a notch.