MONITORING STRUCTURE WITHOUT CHIP

Abstract

A monitoring structure without chip including at least one first monitoring component. The at least one first monitoring component includes a first substrate and a first signal sensing portion. The first signal sensing portion includes a first signal sensing section, a second signal sensing section, a third signal sensing section and a fourth signal sensing section. The first signal sensing section, the second signal sensing section, the third signal sensing section and the fourth signal sensing section are disposed along a periphery of the substrate. The first signal sensing section and the third signal sensing section are connected to two opposite ends of the second signal sensing section, respectively. The fourth signal sensing section is connected to the third signal sensing section, and is spaced apart from the first signal sensing section via a notch.

CPC Classifications