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Acid anhydride compound, polyamideimide resin and film

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Summary

USPTO granted Patent US12595268B2 to Korea Advanced Institute of Science and Technology (KAIST) for a novel acid anhydride compound and polyamideimide resin and film utilizing the same. The invention provides high thermal resistance, low coefficient of thermal expansion, and colorless transparency properties. The patent contains 11 claims and was filed under Application No. 18517326.

Published by USPTO on changeflow.com . Detected, standardized, and enriched by GovPing. Review our methodology and editorial standards .

What changed

USPTO issued Patent US12595268B2 granting exclusive intellectual property rights to KAIST for an acid anhydride compound with a novel chemical structure, and polyamideimide resin and film produced therefrom. The patent claims cover the compound's use in films exhibiting high thermal resistance, low thermal expansion, and optical transparency.

For manufacturers and researchers in polymer chemistry and advanced materials, this patent establishes enforceable IP rights that may restrict competitive development of similar acid anhydride compounds for polyamideimide film applications. Parties engaged in related chemical manufacturing or film production should assess potential licensing needs or design-around considerations.

What to do next

  1. Monitor for updates
  2. Review patent claims for potential infringement concerns

Archived snapshot

Apr 7, 2026

GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.

← USPTO Patent Grants

Acid anhydride compound, and polyamideimide resin and film using the same

Grant US12595268B2 Kind: B2 Apr 07, 2026

Assignee

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventors

Sang Youl Kim, Seong Jong Kim

Abstract

Provided are an acid anhydride compound having a novel structure, and a polyamideimide resin and a polyamideimide film produced therefrom. Specifically, since the polyamideimide film according to the present invention includes a structural unit derived from the acid anhydride compound, it may have high thermal resistance and a low coefficient of thermal expansion while being colorless and transparent.

CPC Classifications

C07D 493/04 C08G 73/14

Filing Date

2023-11-22

Application No.

18517326

Claims

11

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Last updated

Classification

Agency
USPTO
Published
April 7th, 2026
Instrument
Notice
Legal weight
Binding
Stage
Final
Change scope
Minor
Document ID
US12595268B2

Who this affects

Applies to
Manufacturers Educational institutions
Industry sector
3241 Chemical Manufacturing 5417 Scientific Research
Activity scope
Chemical compound manufacturing Polymer film production Research and development
Geographic scope
United States US

Taxonomy

Primary area
Intellectual Property
Operational domain
Legal
Topics
Chemical Manufacturing Scientific Research

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