Wireless Charging Device Heat Dissipation Structure Patent Application

ChangeBridge: Patent Apps - Power Supply (H02J)

Detected March 26th, 2026

Summary

The USPTO has published a patent application for a wireless charging device with an improved heat dissipation structure. The application, filed by Stephen CHEN, details a design incorporating a fan and airflow channels to cool both the charging pad and a mobile device simultaneously.

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What changed

This document is a publication of a patent application (US20260088655A1) filed with the USPTO. It describes a novel heat dissipation structure for wireless charging devices, featuring a housing with a charging pad, intake grille, exhaust assembly, and an internal fan. The design aims to enhance thermal management by directing airflow to cool both the charging pad's heat sink and the mobile device being charged.

While this is a patent application and not a rule or guidance, manufacturers of wireless charging devices and related consumer electronics may find the disclosed technology relevant for product development. Compliance officers in the technology sector should note this publication as an indicator of innovation in product design and potential future intellectual property considerations. No immediate compliance actions or deadlines are associated with this patent application publication.

Source document (simplified)

← USPTO Patent Applications

WIRELESS CHARGING DEVICE WITH HEAT DISSIPATION STRUCTURE

Application US20260088655A1 Kind: A1 Mar 26, 2026

Inventors

Stephen CHEN

Abstract

A wireless charging device with a heat dissipation structure comprises a first housing and a second housing that are mutually combined. The first housing includes at least one charging pad, at least one intake grille, and at least one exhaust assembly. The at least one charging pad protrudes from an outer surface of the first housing and incorporates a heat sink for dissipating thermal energy generated during operation. A fan is positioned between the first housing and the second housing and generates an airflow into the interior of the housing. The airflow is then directed through an airflow channel toward the exhaust assembly of the first housing and an air discharge zone of the second housing. This configuration enables simultaneous cooling of the heat sink and a mobile device, achieving efficient heat dissipation.