USPTO Trademark Application: TSMC NANOFLEX
Summary
The USPTO has received an intent-to-use trademark application (TM98778467) for the mark "TSMC NANOFLEX". The application covers custom manufacturing of semiconductors, memory chips, wafers, integrated circuits, and related technology consultation services. The filing date was September 30, 2024.
What changed
The United States Patent and Trademark Office (USPTO) has recorded an intent-to-use trademark application for the mark "TSMC NANOFLEX" (Application No. 98778467). The application, filed on September 30, 2024, seeks protection for a range of goods and services including the custom manufacture of semiconductors, memory chips, wafers, and integrated circuits, as well as product research, design, testing, and technology consultation services related to these electronic products.
This filing signifies an intent to use the mark in commerce, rather than an existing use. For businesses operating in the computing and electronics sector, particularly those involved in semiconductor manufacturing or related services, this indicates a new brand entering the market. Compliance officers should note this as a potential competitor or partner activity. No immediate compliance actions are required based on this trademark filing itself, as it pertains to intellectual property rights rather than regulatory obligations.
Archived snapshot
Mar 26, 2026GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.
← USPTO Trademark Applications
TSMC NANOFLEX
Intent to Use TM98778467 Kind: intenttouse Mar 24, 2026
Abstract
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits; Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; integrated circuits
Filing Date
2024-09-30
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