Smart Spinal Implant Sensors Patent Granted to Warsaw Orthopedic
Summary
The USPTO granted Patent US12599412B2 to Warsaw Orthopedic, Inc. covering smart spinal implant sensors with measurement capabilities for spinal constructs. The patent includes method claims for attaching sensor-equipped implants to spinal constructs and performing intra-operative adjustments based on received sensor data.
What changed
The USPTO issued Patent US12599412B2 to Warsaw Orthopedic covering smart implant sensors for spinal constructs. The patent discloses methods for attaching sensors to spinal constructs that measure aspects of the construct during surgery, with the ability to perform intra-operative adjustments based on sensor data. The technology covers CPC classifications related to spinal implants and biosensors.
For medical device manufacturers and healthcare providers, this patent establishes exclusive intellectual property rights for Warsaw Orthopedic in smart sensor technology for spinal surgery. Companies developing similar technologies should review potential licensing needs or design-around considerations. The patent does not impose compliance obligations but represents a significant IP position in the smart medical device space.
Archived snapshot
Apr 14, 2026GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.
Intra-operative options for smart implants
Grant US12599412B2 Kind: B2 Apr 14, 2026
Assignee
WARSAW ORTHOPEDIC, INC.
Inventors
Steven D. Glassman, Newton H. Metcalf, Jr., Jerald L. Redmond, Arjun Siby-Kurian, Adam D. Glaser
Abstract
A method of treating a spine includes implanting at least a portion of a spinal construct in a patient. The method further includes attaching one or more smart implants to the spinal construct. Each of the one or more smart implants includes (a) an attachment portion configured to attach the smart implant to the spinal construct, and (b) at least one sensor configured to measure an aspect of the spinal construct when the smart implant is attached to the spinal construct. The method further includes receiving, from the one or more smart implants, sensor information related to the aspect of the spinal construct and performing at least one intra-operational adjustment to the spinal construct based on the received sensor information.
CPC Classifications
A61B 17/7001-7031 A61B 17/7041-7046 A61B 17/7032-704 A61B 5/0031 A61B 5/0024 A61B 5/4566 A61B 5/4851 A61B 5/686 A61B 2562/0261 A61B 17/7049-7052
Filing Date
2023-12-15
Application No.
18542249
Claims
21
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