Protective Assembly for Sensors in Medical Devices
Summary
USPTO published patent application US20260098776A1 for a protective assembly for sensors in medical devices. The invention comprises a substrate with an enclosing port containing electronic components wire-bonded to the substrate, covered by gel material and a fluoropolymer polyimide film (FEP). Medical device manufacturers developing sensor technologies should review this patent for potential overlap with their own IP portfolios.
What changed
USPTO published patent application US20260098776A1 for a protective assembly for sensors in medical devices. The invention comprises a substrate with at least one enclosing port, electronic components disposed within the port cavity and wire-bonded to the substrate, a gel material covering the components, and a fluoropolymer polyimide film (FEP) disposed proximate to the gel material surface.
Medical device manufacturers developing sensor technologies should review this patent publication to assess potential overlap with their existing IP portfolios and consider whether licensing or design modifications may be necessary to avoid infringement.
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Apr 12, 2026GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.
PROTECTIVE ASSEMBLY FOR SENSORS
Application US20260098776A1 Kind: A1 Apr 09, 2026
Inventors
Akshay H B, Rajani Niranjan Jain, Santosh Nagapati Hegde, Sandeep Laxman Maut
Abstract
Apparatuses, systems, and methods are provided for protective assemblies for sensors. In some embodiments, a protective assembly comprises a substrate. In some embodiments, the protective assembly further comprises at least one enclosing port adhered to the substrate. In some embodiments, the protective assembly further comprises one or more electronic components disposed within a cavity of the enclosing port and wire-bonded to the substrate. In some embodiments, the protective assembly further comprises a gel material disposed within the cavity such that it covers the one or more electronic components. In some embodiments, the protective assembly further comprises a fluoropolymer polyimide film (FEP) disposed proximate to a surface of the gel material.
CPC Classifications
G01L 19/0645 A61M 16/0003 G01L 9/00 A61M 2016/0027
Filing Date
2025-09-19
Application No.
19333913
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