US patent grant for electronic component holding member and endoscope
Summary
US patent grant for electronic component holding member and endoscope
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Mar 27, 2026GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.
Electronic component holding member and endoscope
Grant US12582304B2 Kind: B2 Mar 24, 2026
Assignee
OLYMPUS MEDICAL SYSTEMS CORP.
Inventors
Shigeru Hosokai
Abstract
An electronic component holding member includes a first base material including an electronic component, a first resin molded product, and first metal patterns in which a signal pattern and a grounding pattern are formed on a non-planar surface, a second base material including a second resin molded product, and a second metal pattern formed on a non-planar surface so as to overlap at least part of the first metal patterns, and grounding wiring configured to connect the grounding pattern and the second metal pattern.
CPC Classifications
A61B 1/05 A61B 1/0011 A61B 1/051 H04N 23/555 H05K 1/0284
Filing Date
2023-11-21
Application No.
18515720
Claims
10
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Source
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