Image pickup unit with resin in via holes for endoscope
Summary
The USPTO has granted patent US12582294B2 to OLYMPUS CORPORATION for an image pickup unit with resin in via holes for an endoscope. The patent details a specific design for an image pickup substrate, solder resist film, and bonding terminal intended for use in endoscopic devices.
What changed
The United States Patent and Trademark Office (USPTO) has issued patent US12582294B2, granting exclusive rights to OLYMPUS CORPORATION for an "Image pickup unit having resin in via holes for an endoscope." The patent describes a novel configuration for an image pickup unit, focusing on the placement of resin within via holes of an image pickup substrate. Key elements include a specific arrangement of a solder resist film and a bonding terminal made of solder, designed to improve the connection and reliability of through wiring.
This patent grant signifies a new intellectual property right for OLYMPUS CORPORATION in the field of endoscopic imaging technology. While not a regulatory mandate for other entities, it establishes a baseline of protected technology. Manufacturers in the medical device sector, particularly those producing endoscopes or related imaging components, should be aware of this patent to avoid infringement. The filing date was November 21, 2023, and the patent is set to expire on March 24, 2026.
Archived snapshot
Mar 27, 2026GovPing captured this document from the original source. If the source has since changed or been removed, this is the text as it existed at that time.
Image pickup unit having resin in via holes for an endoscope
Grant US12582294B2 Kind: B2 Mar 24, 2026
Assignee
OLYMPUS CORPORATION
Inventors
Keiichi Kobayashi
Abstract
An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface; and a bonding terminal which is made of solder, covers a surface of the solder resist film placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the solder resist film.
CPC Classifications
H01L 24/05 H01L 24/08 H01L 24/13 H01L 24/16 H10F 39/811 H10F 39/12 H10F 77/93 A61B 1/0011 A61B 1/051
Filing Date
2023-11-21
Application No.
18515781
Claims
10
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Source
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