USPTO Grants Patent for Modular Power System
Summary
The United States Patent and Trademark Office (USPTO) has granted a patent for a modular power system. The patent, US12588157B2, was granted on March 24, 2026, and details a system comprising a high current backplane and memory devices for configuration data.
What changed
The USPTO has officially granted patent US12588157B2 for a modular power system. This patent covers a system that includes a high current backplane with multiple slots for power modules and at least one memory device to store configuration data for these modules. The system is designed for efficient operation and configuration management.
This patent grant is primarily an intellectual property event. While it does not impose new regulatory obligations on companies, it signifies innovation in power system technology. Companies operating in the power supply or electronics manufacturing sectors should be aware of this patent as it may affect their product development and intellectual property strategies.
Source document (simplified)
Modular power system
Grant US12588157B2 Kind: B2 Mar 24, 2026
Inventors
Christopher William Fotherby
Abstract
Disclosed is a modular power system. The modular power system comprises a high current backplane for providing electrical connections, the high current backplane comprises a plurality of slots wherein each slot is configured to receive a power module from a plurality of power modules, and wherein a power module of the plurality of power modules can be removably coupled to a slot of the plurality of slots; and at least one memory device configured to store configuration data for one or more of the plurality of power modules, wherein each power module of the plurality of power modules comprises a processor operatively coupled with the at least one memory device to employ the configuration data for a desired operation of the modular power system.
CPC Classifications
H05K 7/026 H05K 7/14324 H05K 7/1457 H02B 1/46 H01M 10/4207 H01M 10/4257 H01M 50/249 H01M 50/258 H01M 50/269 H01M 50/502 H01M 2010/4271 H01M 2220/20 H02J 1/001
Filing Date
2023-11-08
Application No.
18504519
Claims
20
Named provisions
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