USPTO Patent Application - Flexible Circuit

ChangeBridge: Patent Apps - Batteries (H01M)

Published March 19th, 2026

Detected March 23rd, 2026

Summary

The USPTO has published a patent application (US20260082486A1) filed by Chibitronics Inc. on November 19, 2025. The application describes a flexible circuit design utilizing polymer particles and a metallized foil to create conductive traces on a non-conductive substrate.

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What changed

This document is a publication of a patent application filed by Chibitronics Inc. for a flexible circuit technology. The application details a method for creating conductive circuit traces using polymer particles and a metallized foil adhered to a non-conductive substrate, with specific CPC classifications including H05K and H01M.

This publication serves as notice of the patent application and does not impose any new regulatory obligations or compliance requirements on regulated entities. Companies in the electronics manufacturing or materials science sectors may find the technical details of interest for innovation or competitive analysis.

Source document (simplified)

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CIRCUIT

Application US20260082486A1 Kind: A1 Mar 19, 2026

Assignee

Chibitronics Inc.

Inventors

Jie Qi, Jonathan Samuelson

Abstract

A flexible circuit can include an electrically non-conductive substrate, a plurality of polymer particles deposited on the substrate, and an electrically conductive metallized foil. The polymer particles can be deposited onto the substrate according to a circuit trace pattern. The circuit trace pattern can define a path of at least one conductive circuit trace configured to couple electrically to a circuit element. The electrically conductive metallized foil can be configured to adhere to the polymer particles but not to the substrate to form the at least one conductive circuit trace.