RMB 10-Year Bond Tender, RMB1.5bn, 23rd Apr
Summary
The HKMA announced a competitive tender for additional RMB 10-year Government Bonds (issue 10GB3505001) under the Infrastructure Bond Programme. RMB 1.5 billion in bonds maturing on 15 May 2035, bearing interest at 2.29% per annum payable semi-annually, will be auctioned on 23 April 2026 for settlement on 27 April 2026. The tender is open exclusively to appointed Primary Dealers under the Programme, with results expected to be published no later than 3:00 pm on the tender day.
What changed
The HKMA published a formal tender notice for the re-opening of existing 10-year RMB Institutional Government Bonds (issue 10GB3505001) under the Infrastructure Bond Programme. An additional RMB 1.5 billion in bonds will be offered, with accrued interest of RMB 505.05 per minimum denomination of RMB 50,000 payable at settlement.
The tender is open only to appointed Primary Dealers; competitive bids must be submitted in RMB 50,000 increments or multiples thereof. Non-Dealer investors wishing to participate must do so through a Primary Dealer on the latest published list. The bonds are fully fungible with existing 10GB3505001 listed on the Stock Exchange of Hong Kong (Stock code: 85024).
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Tender of 10-year RMB HKSAR Institutional Government Bonds through re-opening to be held on Thursday, 23 April 2026
Press Releases
20 Apr 2026
Tender of 10-year RMB HKSAR Institutional Government Bonds through re-opening to be held on Thursday, 23 April 2026
The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced today (20 April) that a tender of 10-year RMB institutional Government Bonds (Bonds) through the re-opening of existing 10-year Government Bond issue 10GB3505001 under the Infrastructure Bond Programme will be held on Thursday, 23 April 2026, for settlement on Monday, 27 April 2026.
An additional amount of RMB1.5 billion of the outstanding 10-year Bonds (issue no. 10GB3505001) will be on offer. The Bonds will mature on 15 May 2035 and will carry interest at the rate of 2.29% per annum payable semi-annually in arrear. The Indicative Pricings of the Bonds on 20 April 2026 are 102.99 with a semi-annualised yield of 1.929%.
Tender is open only to Primary Dealers appointed under the Infrastructure Bond Programme. Anyone wishing to apply for the Bonds on offer can do so through any of the Primary Dealers on the latest published list, which can be obtained from the Hong Kong Government Bonds website at https://www.hkgb.gov.hk. Each tender must be for an amount of RMB50,000 or integral multiples thereof.
Tender results will be published on the HKMA’s website, the Hong Kong Government Bonds website, Bloomberg (GBHK
Hong Kong Monetary Authority
20 April 2026
HKSAR INSTITUTIONAL GOVERNMENT BONDS TENDER INFORMATION
Tender information of 10-year RMB HKSAR Institutional Government Bonds:-
| Issue Number | : | 10GB3505001 |
|---|---|---|
| Stock Code | : | 85024 (HKGB2.29 3505-R) |
| Tender Date and Time | : | Thursday, 23 April 2026 |
9:30 am to 10:30 am |
| Issue and Settlement Date | : | Monday, 27 April 2026 |
| Amount on Offer | : | RMB1.5 billion |
| Maturity | : | 10 years |
| Remaining maturity | : | Approximately 9.05 years |
| Maturity Date | : | Tuesday, 15 May 2035 |
| Interest Rate | : | 2.29% p.a. payable semi-annually in arrear |
| Interest Payment Dates | : | 15 May and 15 November in each year, commencing on the Issue Date up to and including the Maturity Date, subject to adjustment in accordance with the terms of the Institutional Issuances Information Memorandum of the Infrastructure Bond Programme and Government Sustainable Bond Programme (Information Memorandum) published on the Hong Kong Government Bonds website. |
| Method of Tender | : | Competitive tender |
| Tender Amount | : | Each competitive tender must be for an amount of RMB50,000 or integral multiples thereof. Any tender applications for the Bonds must be submitted through a Primary Dealer on the latest published list.
The accrued interest to be paid by successful bidders on the issue date (27 April 2026) for the tender amount is RMB505.05 per minimum denomination of RMB50,000.
(The accrued interest to be paid for tender amount exceeding RMB50,000 may not be exactly equal to the figures calculated from the accrued interest per minimum denomination of RMB50,000 due to rounding). |
| Other Details | : | Please see the Information Memorandum available on the Hong Kong Government Bonds website or approach Primary Dealers. |
| Expected commencement date of dealing on
the Stock Exchange
of Hong Kong Limited | : | The tender amount is fully fungible with the existing 10GB3505001 (Stock code: 85024) listed on the Stock Exchange of Hong Kong. |
| Use of Proceeds | : | The Bonds will be issued under the institutional part of the Infrastructure Bond Programme. Proceeds will be invested in infrastructure projects in accordance with the Infrastructure Bond Framework published on the Hong Kong Government Bonds website. |
Hong Kong Monetary Authority
20 April 2026
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- 20 Apr 2026 Tender of 10-year RMB HKSAR Institutional Government Bonds through re-opening to be held on Thursday, 23 April 2026
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