Interposer interconnects and enclosure for silicon photonics LIDAR module

Abstract

Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.

CPC Classifications