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Gate structures for semiconductor devices

Grant US12581725B2 Kind: B2 Mar 17, 2026

Assignee

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventors

Chung-Liang Cheng

Abstract

A semiconductor device with different configurations of gate structures and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes first and second gate structures disposed on first and second nanostructured channel regions, respectively. The first gate structure includes a nWFM layer disposed on the first nanostructured channel region, a barrier layer disposed on the nWFM layer, a first pWFM layer disposed on the barrier layer, and a first gate fill layer disposed on the first pWFM layer. Sidewalls of the first gate fill layer are in physical contact with the barrier layer. The second gate structure includes a gate dielectric layer disposed on the second nanostructured channel region, a second pWFM layer disposed on the gate dielectric layer, and a second gate fill layer disposed on the pWFM layer. Sidewalls of the second gate fill layer are in physical contact with the gate dielectric layer.

CPC Classifications

H10D 84/038 H10D 30/031 H10D 30/6735 H10D 30/6739 H10D 30/6757 H10D 62/121 H10D 84/0167 H10D 84/0177 H10D 84/85 H10D 62/052 H10D 62/133 H10D 84/0188 H10D 84/135 H10D 84/201 H10D 44/061 H10D 48/345 H10D 64/117 H10D 48/071 H10D 64/519 H01L 21/02244 H01L 21/02252 H01L 21/02603 H01L 21/28088 H01L 21/0228 H01L 21/28185 H01L 21/02153 A23B 2/783 A23B 2/605 A61K 40/4218 A61K 40/4277 H02K 15/027 H10F 55/20 H10F 99/00 H10H 20/826 B82Y 10/00

Filing Date

2024-06-26

Application No.

18754468

Claims

20