← USPTO Patent Applications

SEALANT RESIN COMPOSITION, AND USE THEREOF

Application US20260085218A1 Kind: A1 Mar 26, 2026

Assignee

MITSUI CHEMICALS, INC.

Inventors

Takahiro MIZUMA, Manabu ITAKURA, Nozomi KAMIYA, Kiminori NODA, Makoto EGAWA

Abstract

The purpose of the present invention is to provide a sealant resin composition having excellent resistance to whitening during stretching, and good heat seal strength, as well as good heat seal strength after heat aging. The present invention relates to a sealant resin composition (X) including a 1-butene/ethylene copolymer (A) satisfying a specific requirement, and a propylene-based polymer (B), the resin composition satisfying the following requirements (X1) and (X1-2): requirement (X1): having a Shore D hardness measured in accordance with ASTM D2240 being in a range of 44 to 80; and requirement (X1-2): having a melt flow rate (MFR) measured at 230° C. and a load of 2.16 kg in accordance with ASTM D1238 being 0.1 to 100 g/10 min.

CPC Classifications

C09K 3/1006 H01M 10/0525 H01M 50/119 H01M 50/121 H01M 50/124 H01M 50/134 C09K 2200/062

Filing Date

2023-09-05

Application No.

19108680