← EPO Patent Bulletin

CRYOGENIC-COMPATIBLE HERMETIC PACKING FOR SUPERCONDUCTING QUANTUM CHIPS

Publication EP4631329A1 Kind: A1 Mar 18, 2026

Applicants

IQM Finland Oy

Inventors

ORGIAZZI, Jean-Luc, SAIRA, Olli-Pentti

IPC Classifications

H10N 69/00 20230101AFI20240614BHEP H10N 60/01 20230101ALI20240614BHEP H10N 60/81 20230101ALI20240614BHEP G06N 10/40 20220101ALI20240614BHEP

Designated States

AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR