NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM USING SAME, CURED RELIEF PATTERN PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Publication
EP2026029152A1
Kind: A1
Mar 18, 2026
Inventors
The designation of the inventor has not yet been filed
IPC Classifications
G03F 7/027 20060101AFI20260207BHEP
C07D 209/86 20060101ALI20260207BHEP
C08F 299/02 20060101ALI20260207BHEP
G03F 7/20 20060101ALI20260207BHEP
G03F 7/031 20060101ALI20260207BHEP
G03F 7/037 20060101ALI20260207BHEP
Designated States
AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR